ERSASCOPE 2 (discontinued)
Article No.: 0VSSC600
High end inspection system for BGA, µBGA, CSP, Flip Chip and other hidden solder joints. Product discontinued 08/2018.
ERSASCOPE 2 - the complete solution for the inspection of BGA, CSP, Flip Chip, heel filling, THT throughput and other hidden solder joints
- High end endoscope inspection system
including three quick change heads:
- 90° BGA head (approx. 280 µm clearance)
- 90° Flip Chip head (approx. 30 µm clearance)
- 0° wide angle head, e.g. for VIA inspection without tilting of optics - 7 movement axes for flexible adjustment to
practically every required viewing angle - High-performance, dimmable LED lighting in daylight colour
- High quality 1.3 megapixel CCD colour camera with USB connection
- XY rotary table with fine adjust wheels, freely positionable under the optics
- Optimal light management:
- inspection heads with fibre optic stereo front light
- mechanically coupled, swivelling and rotating backlight
- fibre optic gooseneck for targeted lighting from all sides
- separate setting of light quantity for all light guides
- with light brushes, light extension and iris aperture - Focusing scale to be used with calibration groups in the
ImageDoc EXP measuring function - Complete set with the most important accessories and storage case
-- Product discontinued --
Alternative product: Ersascope M
Questions about the product? Please find your personal contact here.