HR 600/3P (discontinued)
Article No.: 0HR600/3P
Precise: automatic rework for extremely fine and small components up to 01005
High-precision rework of fine pitch and chip components
Technical Highlights:
- High-precision axis system (X, Y, Z) and high-resolution cameras
- Automated component placement as well as soldering and desoldering processes
- Hybrid heating head with two heating zones
- Large-area, powerful IR bottom heater in three zones
- Non-contact temperature measurement with digital sensor
- Three K-type thermocouple inputs for Accu-TC sensor
- Effective component cooling with compressed air
Technical Data
up to 535 x 300 mm (+x) (0HR600/3PL)
Application
Automatic repair process:
Desoldering, placement and soldering of all types of surface mounted devices (SMD): BGA, metallic BGA, CGA, BGA socket, QFP, PLCC, MLF and miniature components up to 01005.
Options
Ersa recommends the following accessories:
K type for the second measuring channel
Article No.: 0IR6500-37
Article No.: 0IR6500-37
AccuTC Sensor without fixture
K type for the second measuring channel
Spare sensor or second sensor for temperature control of temperature-sensitive components in the environment of the repair solder joint; sensor diameter approx. 0.5 mm.
K type, for the second measuring channel
Article No.: 0IR4510-02
Article No.: 0IR4510-02
Temperature Sensor Cord
K type, for the second measuring channel
Sensor to observe the plate bottom side or for mounting at temperature-sensitive components. The sensor can be stuck with Kapton tape; sensor diameter approx. 0.3 mm.
suitable for AccuTC and AccuTC 2.0
Article No.: 0HR640
Article No.: 0HR640
TE Holder for HR 600
suitable for AccuTC and AccuTC 2.0
Hinged bracket with four pivots for easy and secure positioning of the AccuTC temperature sensor on the plate; you can use the holder with the other Ersa Rework Systems, too.
Additional products
Available Versions
The following product versions or modules are available:
Article No.: 0HR600/3P
HR 600/3P Hybrid Rework System
Article No.: 0HR600/3PBHL
HR 600/3P with lowered bottom heating
For the treatment of PCBs with high components on the bottom side. The downward clearance increases from 30 to 65 mm. Caution: Solder profiles have to be adjusted.
Article No.: 0HR600/3PL
HR 600/3P with PCB holder 535 x 300 mm (+x)
Treatment of bigger PCBs. NOTE: not the entire size of the holder is preheated from the bottom. Some regions cannot be reached by heating- or placement head as the axis system remains unchanged.
Article No.: 0HR600/3PLBHL
HR 600/3P with PCB holder 535 x 300 mm (+x) and lowered bottom heating
Treatment of bigger PCBs. NOTE: not the entire size of the holder is preheated from the bottom. Some regions cannot be reached by heating- or placement head as the axis system remains unchanged.
For the treatment of PCBs with high components on the bottom side. The downward clearance increases from 30 to 65 mm. Caution: Solder profiles have to be adjusted.