IR/PL 650 (discontinued)

Article No.: 0IR650A & 0PL650A
High-performance, universal IR Rework System with semiautomatic component placement. Product discontinued 08/2019.

Ersa IR/PL 650 Rework System (PC & monitor optional at request)
Ersa IR/PL 650 Rework System (PC & monitor optional at request)
Placing module (0PL650A)
BGA component at placing nozzle of PL 650
Reflow Process Camera module
Ersa IR / PL 650 application
   
 
 
  • Four programmable heating zones in the top emitter 1,200 W
  • Five programmable heating zones in the bottom emitter 3,200 W
  • Integrated "DIGITAL 2000 A'' solder station for rework
    and removal of residual solder
  • Four thermocouple measuring channels and a non-contact IR sensor
  • Dynamic IR heating technology for large (460 x 560 mm) PCBs
  • High precision (+/- 0.025 mm) Auto Pick & Place with motor zoom AF camera
  • Intuitive operation with PC connection
  • Process control and documentation via the operator software IRSoft
  • Motor zoom reflow process camera for process viewing
  • Suitable for the use of the Dip&Print Station

 

-- Product discontinued 08/2019 --


Alternative products: HR 600, HR 550, HR 600 XL, HR 550 XL


Questions about the product? Please find your personal contact here.

Technical Data

IR 650 Rework System
Dimensions (W x D x H) in mm
794 x 602 x 462
Weight in kg
75
Antistatic Design (y/n)
y
Power Rating in W
3,600
Nominal voltage in V AC
230
Upper heating
IR emitter (4 x 300 W)
Lower heating
IR emitter (2 x 800 and 4 x 400 W)
PCB size in mm
from 20 x 20 to 460 x 560
Component size in mm
from 1 x 1 to 60 x 60
Operation
Windows PC
Test symbol
CE
PL 650 motor-driven Precision Placement System
Dimensions (W x D x H) in mm
200 x 700 x 690
Weight in kg
21
Antistatic Design (y/n)
y
Power Rating in W
50
Nominal voltage in V AC
100 - 230
PCB size in mm
from 20 x 20 to 460 x 560
Component size in mm
from 1 x 1 to 60 x 60
Placement accuracy in mm
up to 0.010 mm
Zoom factor
25 x optical and 12 x digital
Operation
Windows PC
Test symbol
CE
Reflow Process Camera module (RPC)
Style
PAL CCD motor zoom camera with dimmable LED ring light
Zoom factor
25 x optical and 12 x digital

Application

High-performance assembly unit repair

Flexible desoldering, placement and soldering of all types of surface mounted devices (SMD), especially: high mass BGA, metallic BGA, CGA, CCGA, BGA socket, multilayer boards or aluminium laminated substrate, BGA-multiway connector, large QFP, large PLCC, high pole THT components; for QFP components an optional split optics cassette is available.

Questions to your applications will be answered by our Ersa Experts.

Options

Ersa recommends the following accessories:

Micro-Pickup Type 0510
Micro-Pickup Type 0510

Metallic Micro-Nozzle 0.9 mm with Silicone Suction Cup 1 mm

Article No.: 0IR5500-40 + 0IR4520-07
 

Additional products

More accessory you will find in the Ersa Shop.

Available Versions

The following product versions or modules are available:

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