HR 600 (discontinued)

Hybrid Rework System - automatic desoldering, placement and soldering of SMT components. Product discontinued, replaced by HR 600/2.

HR 600 Hybrid Rework System complete with Reflow Process Camera
HR 600 Hybrid Rework System complete with Reflow Process Camera
Placement of BGA component with HR 600
Unsoldering of component with HR 600
Hybrid heating head with interchangeable baffles
Screenshot HRSoft
Placement of BGA component with HR 600
Unsoldering of component with HR 600
Hybrid heating head with interchangeable baffles
Screenshot HRSoft
HR 600 Hybrid Rework System complete with Reflow Process Camera
   
 
 

Videos

Ersa Hybrid Rework System HR 600

 

New definition of assembly unit repair - automatic, flexible and process reliable!

  • Highly efficient 800 W hybrid heating head
  • Homogeneous, large-area IR bottom heating with 3 heating zones at 800 W each
  • Automatic and precise component alignment with the help of machine vision
  • Highly accurate, motor-driven axis system
    for component placement (+/- 0.025 mm)
  • User independent, reproducible repair results guaranteed
  • Process control and documentation via the operator software HRSoft
  • Fully automatic or semiautomatic operation
  • Suitable for the use of the dip & print station

 

-- Product discontinued --

 

Alternative products: HR600/2, HR600/3P

Technical Data

Dimensions (W x D x H) in mm
850 x 600 x 580
Weight in kg
40
Antistatic Design (y/n)
y
Power Rating in W
3,200
Nominal voltage in V AC
230
Compressed air connection
6-10 bar (free of oil), 1/4 inch quick bar connect
Upper heating
Hybrid emitter (2 x 400 W), 60 x 60 mm
Lower heating
IR emitter (3 x 800 W), 380 x 250 mm
PCB size in mm
from 20 x 20 to 390 x 285 (+x)
Component size in mm
from 1 x 1 to 50 x 50
Operation
Windows PC
Test symbol
CE
Option
RPC 600 - camera: 10 MP CMOS USB color camera, 25 mm focal width; lighting: 2x LED point light source, dimmable

Application

Automatic repair process:

Desoldering, placement and soldering of all types of surface mounted devices (SMD): BGA, metallic BGA, CGA, BGA socket, QFP, PLCC, MLF and miniature components with an edge length of up to 1 x 1 mm.

BGA
BGA base
QFN
QFP
SMD Components
CSP Rework
 

Questions to your applications will be answered by our Ersa Experts.

Options

Ersa recommends the following accessories:

Ersa Reflow Process Camera for HR 600
Ersa Reflow Process Camera for HR 600

for observation of the soldering process

Article No.: 0HR610
AccuTC Sensor without fixture
AccuTC Sensor without fixture

K type for the second measuring channel

Article No.: 0IR6500-37
AccuTC 2.0 Thermocouple
AccuTC 2.0 Thermocouple

K type, for the second measuring channel

Article No.: 0HR645
Temperature Sensor Cord
Temperature Sensor Cord

K type, for the second measuring channel

Article No.: 0IR4510-02
TE Holder for HR 600
TE Holder for HR 600

suitable for AccuTC and AccuTC 2.0

Article No.: 0HR640
PCB Holder HR 600 (big)
PCB Holder HR 600 (big)

for plate size up to 300 x 535 mm

Article No.: 0HR635
 

Additional products

More accessory you will find in the Ersa Shop.

Available Versions

The following product versions or modules are available:

HR 600 Hybrid Rework System
HR 600 Hybrid Rework System

Article No.: 0HR600
HR 600 with lowered bottom heating
HR 600 with lowered bottom heating

Article No.: 0HR600-BHL
HR 600 with PCB Holder 300 x 535 mm
HR 600 with PCB Holder 300 x 535 mm

Article No.: 0HR600-L
 

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