Ersa explains #4.4 – BGA soldering
In part four Ersa finally shows important topics during installation of a new BGA component

In part four Ersa finally shows important topics during installation of a new BGA component. A temperature profile adopted to the thermal requirement of the assembly guarantees safe soldering of the previously placed Ball Grid Array.
Links to the related products:
Ersa HR 550 | Ersa HR 600/2 |