CEM basic material

Lower-cost composite base material for pcb's, lying qualitatively below FR4 materials. CEM-1, the cheapest base material, is epoxy resin impregnated, cellulose paper based laminate with only one layer of woven glass fabric. CEM-3 has a core of woven glass with epoxy resin impregnation and woven glass fabric on its outer surfaces.

Weitere Begriffe

Cooling gradient, Coefficient of expansion, Component, Crack, CAD, CAF, CAM, Chemical silver, Chemical tin, Chip, Chip component, Chip bonding, Chip carrier, Chip on board, Chloride, Coffin Manson, Computer controlled soldering systems , Conformal coating, Connected solder balls, Crack