Connected solder balls

Small solder balls, found at the side of chip components after reflow soldering. They are not critical when they are tightly packed in with flux residue. To reduce their occurrence, the openings in stencil of the printer should be optimized.

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Cooling gradient, Coefficient of expansion, Component, Crack, CAD, CAF, CAM, CEM basic material , Chemical silver, Chemical tin, Chip, Chip component, Chip bonding, Chip carrier, Chip on board, Chloride, Coffin Manson, Computer controlled soldering systems , Conformal coating, Crack