Cooling Module

Cooling modules are used in wave- and reflow soldering systems, in order to cool down an assembly under controlled conditions. Frequently, the cooling air will be cooled down to below the room temperature. It is imperative to observe the permissible cooling gradients of the components.

Weitere Begriffe

Cooling gradient, Coefficient of expansion, Component, Crack, CAD, CAF, CAM, CEM basic material , Chemical silver, Chemical tin, Chip, Chip component, Chip bonding, Chip carrier, Chip on board, Chloride, Coffin Manson, Computer controlled soldering systems , Conformal coating, Connected solder balls
 
 
 
 
 
 
 
 
 
 
 
 
 
Back to overview