Crack

Cracks found in solder joints, caused by thermo-dynamical stress. Different coefficients’ of expansion of the component and the board are most frequently the cause.

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Cooling gradient, Coefficient of expansion, Component, Crack, CAD, CAF, CAM, CEM basic material , Chemical silver, Chemical tin, Chip, Chip component, Chip bonding, Chip carrier, Chip on board, Chloride, Coffin Manson, Computer controlled soldering systems , Conformal coating, Connected solder balls