From time to time - for example in a repair situation - it may become necessary to remove already soldered components from the pcb. Here the de-soldering is the reverse of the normal soldering process. The complete solder present at the solder joint needs to be liquefied, so that the component (SMD as well as through-hole components) can be removed. Two techniques have prevailed in industry. One of these is the method utilizing a de-solder braid. This is constituted by a wick-type ribbon braided from copper strands, whereby the copper strands, through capillary action, soak up the liquid solder. The other method relies on desoldering irons or pumps. Similar to standard soldering irons, these tools also have tips but they are hollow. With the tip, the solder of the joint is liquefied, and by applying a small vacuum the now liquid solder is sucked up through the hollow inner of the tip and deposited in a collection container.