DIL/DIP

Dual In-line Package or Dual In-Line are interchangeable terms. They represent the classical body form for leaded IC's - oblong, with two rows of connecting pins, one each on the opposing long side.

Weitere Begriffe

Dissolution, Desoldering Iron, Desoldering, Delamination, DFM, DFR, Die, Die bonding, Diffusion, Diffusion zone, Dispenser, Dual wave soldering, Desoldering, Desoldering Iron, Desoldering Tweezers, Dewetting, Defect rate, Dip Soldering, Dross, Demand on soldering heat