Dip Soldering

Dip soldering is a process, where the full area of the assembly horizontally makes contact with the surface of the liquid solder, to be lifted off again after 2 – 3 seconds. It is crucial in this process, that no solder is allowed to get on to the top side of the board.

Weitere Begriffe

Dissolution, Desoldering Iron, Desoldering, Delamination, DFM, DFR, Die, Die bonding, DIL/DIP, Diffusion, Diffusion zone, Dispenser, Dual wave soldering, Desoldering, Desoldering Iron, Desoldering Tweezers, Dewetting, Defect rate, Dip Soldering, Dross
 
 
 
 
 
 
 
 
 
 
 
 
 
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