Dip Soldering

Dip soldering was a process step of solder-cut-solder systems, where a board with long, untrimmed leads was lowered, in the first step, onto the surface of a solder bath, so that the complete underside was in contact with the solder surface. Modified, this method is applied now in the selective soldering process. Here, the assembly is brought in contact with small solder waves, whose shape and location corresponds exactly to the solder joints to be made. By individually forming multiple solder joints, short cycle times can be achieved on the assemblies.