Drying is the term for conditioning pcb’s and components over an extended period of time to drive out moisture. The temperature range for drying is between 110°C - 120°C. When drying in a vacuum, the temperature can be lowered. During the drying process, unwanted moisture and other volatile components that are left from the board manufacturing process or that have entered at a later stage during transport or storage are to be removed from the board and the components. If these volatile components are still present during soldering, the high internal vapor pressure may develop. This can lead to cracking of the components or to delamination of the base material of the printed circuit board.