Fillet lifting

Fillet lifting is the term for the separation of the solder from the copper pad, taking place during the cooling down after the solder process. Causes for the fillet lifting are most likely the differences in the coefficients of expansion of the solder, the board and the copper pads.

Weitere Begriffe

Fatigue failure, Fiducial marks, Fine Pitch, Finger conveyor, Flame retardants / Flame resistants', Flat Packs, Flow characteristics, Flip Chip, Flux, Flux deposition, Flux density, Flux residue, Foot print, FR 2 board material, FR 4 board material, FR 5 board material, Freon, Functional test, Fiber glass, Fiducial Mark
 
 
 
 
 
 
 
 
 
 
 
 
 
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