The term leadframe refers to the carrier of semiconductors in the shape of a stamped metal strip. Aside from the chip carrier, the connecting pins of the future component are also integrated into the leadframe. The chips are die-bonded onto the leadframe. The contact areas of the chips are connected to the pins via wire bonds. After the bonding, the leadframe is enclosed with a thermosetting plastic. The connecting pins extend from the plastic housing, and are cut and formed in a final step.