Metal-Core Substrate

Assemblies for power electronic applications need to have, as rule, provisions to safely conduct away the heat generated. This can require that the heat is also removed through the pcb itself. To achieve this, one or more inner layers of a heat conducting metal are integrated as the core. These layers can, at the same time, be used as tracks to conduct high voltages. The heat capacity of these pcb’s is rather high, which means that for the soldering process to be successful, large amounts of heat has to be provided to achieve the temperatures necessary at the solder joint.