Micro Sectioning

Micro-sectioning is a destructive analysis of a section, for example of an electronic assembly. The desired section is removed from the assembly with a diamond saw and potted in resin. After the resin has hardened, the potted section is being ground down to the desired location and then polished. The micro-section can now be analyzed with an optical microscope or an electron microscope. The section shows the microstructure of the material, and defects in the structure can be made visible.