MID

Injection molded, 3D plastic carriers to which metallized tracks have been added are referred to as MID. The plastic carrier becomes an interconnect device, the standard pcb is eliminated. Components are placed directly on to the metallization into solder paste and soldered.

Weitere Begriffe

Miss print, Microstructure, Manual placement, Main Solder Wave , Magnesium, Manhattan Effect, Multiple Soldering Processes, Multilayer Board, MELF Components, Meniscus, Measuring Board, Metal Content, Metallization, Metal-Core Substrate, Metal Stencil, Microvias, Miniwave Soldering, Migration, Multi-Chip Module, Multilayer
 
 
 
 
 
 
 
 
 
 
 
 
 
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