Multiple Soldering Processes

Multiple soldering processes are required if the design of the board calls for different soldering processes. This can be the case when the board is to have components on both sides. Large components, which are added after the reflow process, may also call for an additional selective soldering cycle.

Weitere Begriffe

Miss print, Microstructure, Manual placement, Main Solder Wave , Magnesium, Manhattan Effect, Multilayer Board, MELF Components, Meniscus, Measuring Board, Metal Content, Metallization, Metal-Core Substrate, Metal Stencil, Microvias, Miniwave Soldering, MID, Migration, Multi-Chip Module, Multilayer
 
 
 
 
 
 
 
 
 
 
 
 
 
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