Pad Design

Pad design is involved with the size and shape of a solder pad. Optimal pad geometry is the basis for good, reliable solder joints. Requirements on the pad depend on the type of soldering process selected.

Weitere Begriffe

Pad, Paste release, Pick-and-Place unit, Placement offset, Pencil point tips, Printing speed, Print head, Printing offset, Plated-through holes , Precious metal, Plating, Printed circuit, Pyrometer Infrared Sensor, Pulse Soldering, Particle Size, Plastic Squeegee , PCB surface finish, Pad, Pad Lifting, Palladium
 
 
 
 
 
 
 
 
 
 
 
 
 
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