Pad Lifting

Pad lifting is an occurrence which leads to the separation of a pad form the base material of the PCB. This effect is contingent on the behavior of the applied solder alloy during solidification, and very much dependent on the solder temperature.

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Pad, Paste release, Pick-and-Place unit, Placement offset, Pencil point tips, Printing speed, Print head, Printing offset, Plated-through holes , Precious metal, Plating, Printed circuit, Pyrometer Infrared Sensor, Pulse Soldering, Particle Size, Plastic Squeegee , PCB surface finish, Pad, Pad Design, Palladium