Paste release

Term describing the behavior of a solder paste at the time when the stencil, after having completed the printing process, separates from the solder depot printed. The behavior of the paste during the release from the aperture is influenced by the geometry of the aperture, the roughness of the surface of the aperture walls and the behavior of the solder paste itself.

Weitere Begriffe

Pad, Pick-and-Place unit, Placement offset, Pencil point tips, Printing speed, Print head, Printing offset, Plated-through holes , Precious metal, Plating, Printed circuit, Pyrometer Infrared Sensor, Pulse Soldering, Particle Size, Plastic Squeegee , PCB surface finish, Pad, Pad Design, Pad Lifting, Palladium