Peak

The peak is the so-called crest in the temperature / time sequence of a soldering process. In the lead-free reflow process, the peak lies by appr. 20°– 30°C above the melting point of the solder.

Weitere Begriffe

Pad, Paste release, Pick-and-Place unit, Placement offset, Pencil point tips, Printing speed, Print head, Printing offset, Plated-through holes , Precious metal, Plating, Printed circuit, Pyrometer Infrared Sensor, Pulse Soldering, Particle Size, Plastic Squeegee , PCB surface finish, Pad, Pad Design, Pad Lifting
 
 
 
 
 
 
 
 
 
 
 
 
 
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