Pin in Paste

In the pin-and-paste technology, also known as THR (= Through-Hole-Reflow) technology leaded components (THT) are soldered in the reflow process. Paste is printed into the through holes for the pins and the through-hole components are assembled on the board. During melting of the paste in the reflow system, the liquid solder is pulled, due to the wetting- and the capillary forces, into the through-holes, thus forming the solder joint. Note that because of the high thermal loads in the reflow process, the components need to be able to tolerate and withstand the high temperature.

Weitere Begriffe

Pad, Paste release, Pick-and-Place unit, Placement offset, Pencil point tips, Printing speed, Print head, Printing offset, Plated-through holes , Precious metal, Plating, Printed circuit, Pyrometer Infrared Sensor, Pulse Soldering, Particle Size, Plastic Squeegee , PCB surface finish, Pad, Pad Design, Pad Lifting