Pre-solder Wave / Chip Wave

In the wave soldering process of SMT components, the bodies of the components represent an obstruction which disturbs the laminar flow of the main solder wave. Skips, non-soldered joints can be the result. In order to reduce these defects when soldering SMT components, pre-solder waves with very dynamic flow characteristics are used. Their only purpose is to wet the SMT components. Any excess solder is removed by the following main wave, so that defect-free joint can be made.

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Pad, Paste release, Pick-and-Place unit, Placement offset, Pencil point tips, Printing speed, Print head, Printing offset, Plated-through holes , Precious metal, Plating, Printed circuit, Pyrometer Infrared Sensor, Pulse Soldering, Particle Size, Plastic Squeegee , PCB surface finish, Pad, Pad Design, Pad Lifting