Pulse Soldering

Also called stamp soldering or resistance soldering. For this process, a stamp corresponding to the outline of the component to be soldered is being used. With a resistance heater, this stamp is heated up with short impulses, while pressing the pre-tinned components to the pad and melting the solder. With resistance soldering an intense heat can be rapidly developed directly within the joint area and in a tightly controlled manner. This allows a faster ramp up to the required solder melt temperature and minimizes thermal travel away from the solder joint, which helps to minimize the potential for thermal damage to materials or components in the surrounding area. Heat is only produced while each joint is being made.

Weitere Begriffe

Pad, Paste release, Pick-and-Place unit, Placement offset, Pencil point tips, Printing speed, Print head, Printing offset, Plated-through holes , Precious metal, Plating, Printed circuit, Pyrometer Infrared Sensor, Particle Size, Plastic Squeegee , PCB surface finish, Pad, Pad Design, Pad Lifting, Palladium