Reflow Soldering

Reflow soldering is the standard method to solder SMD components. Solder and flux are already on the pads, and in the reflow process only thermal energy in a closely defined temperature / time profile is brought to the board assembly. The complete assembly is heated up to over the melting point of the solder paste, which melts and forms the solder joints. Established reflow processes are convection reflow and condensation reflow (vapor phase soldering).