Separation Speed

The separation speed is the speed with which the stencil is lifted off from the board. The separation speed influences the release of the paste from the apertures. The speed is dependent on the rheology of the paste, and is usually recommended in the dada sheets of the paste manufacturers.

Weitere Begriffe

Snap-off , Solder pastes balling test , Single sided PCB, Strength, Slump, Solder Creep, Soft Beam Soldering, Solvent , Solderability, Solder Defect, Soldering Iron, Solder Pad, Soldering gun, Solder fume, Soldering Robot, Solder bridges, Solder Depot, Solder Preforms, Solder Balling Test, Solder Alloy
 
 
 
 
 
 
 
 
 
 
 
 
 
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