Snap-off

Distance between stencil underside and upper surface of pcb. Normally, when printing solder paste, the stencil rests right on the board surface, i.e., the snap-off is 0 distance. Should the board be warped, or should the underside support of the pcb be insufficient, the condition of a snap-off could be existing. This very often leads to printing defects.

Weitere Begriffe

Solder pastes balling test , Single sided PCB, Strength, Slump, Solder Creep, Soft Beam Soldering, Solvent , Solderability, Solder Defect, Soldering Iron, Solder Pad, Soldering gun, Solder fume, Soldering Robot, Solder bridges, Solder Depot, Solder Preforms, Solder Balling Test, Solder Alloy, Solder Meniscus
 
 
 
 
 
 
 
 
 
 
 
 
 
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