Tackiness

Tackiness is the measure of adhesional strength of a solder paste. SMD’s are placed, with small force, on the solder paste depot. That the components do not move or fall off the pad during transporting the board into the reflow system, the solder paste needs to have certain tackiness, gluing strength.

Weitere Begriffe

Thick film technology, Thin film technology, Tomb stone effect, Track, Temperature Profile, Temperature Profile Measurement, Tempering, Thermal Expansion, Thermal Mass, Thermocouple, Thermography, Through Hole Reflow, Thixotropy, Tip Reactivator, Tolerance, Tombstone Effect, Twisting / Warping, Thermal Capacity, Time over Liquidus, Tin
 
 
 
 
 
 
 
 
 
 
 
 
 
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