Tempering

The purpose of tempering boards and components over a prolonged period of time is to remove stresses that may be present. Boards are tempered at constant temperatures above the glass transition temperature of the base material.

Weitere Begriffe

Thick film technology, Thin film technology, Tomb stone effect, Track, Tackiness, Temperature Profile, Temperature Profile Measurement, Thermal Expansion, Thermal Mass, Thermocouple, Thermography, Through Hole Reflow, Thixotropy, Tip Reactivator, Tolerance, Tombstone Effect, Twisting / Warping, Thermal Capacity, Time over Liquidus, Tin
 
 
 
 
 
 
 
 
 
 
 
 
 
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