Thick film technology

Tracks, resistors and capacitors are screen printed on to an insulating carrier. Pasty mixtures with conductive or dielectrical capability are used to print. After being printed, the pastes undergo a burning-in process in an oven, whereby the materials fuse to very durable and reliable layers. The thickness of the layer is between 10 and 50 µm. Additional active and passive electronic SMD components are added in a further process step and the reflow soldered. In this manner, cost effective modules with a high level of reliability are build, which can be exposed to even critical environmental conditions.