Ultrasonic Soldering

In the ultrasonic soldering process, surface oxides are removed from the surface through cavitation, so that the solder, hitting the pad with high speeds, meets a clean and oxide-free surface. The ultrasonic oscillator is in direct contact with the liquid solder, transferring its energy via the solder. This facilitates wetting of glass, ceramics, aluminum etc. Fluxes for these wetting processes are not required.